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• Metcal BGA-3590 Rework System
• Metcal CSP-3500 Rework System
• Product Type: BGA Reflow Nozzle (Hot Air Nozzle)
• Model: BGA-450-450
• Nozzle Size: 45 × 45 mm
• Nozzle Shape: Square (Quad Tip)
• Compatible Components: Large-sized BGA packages
• Heating Technology: Precise convection hot air
• Air Flow: Homogeneous and controlled hot air distribution over the BGA component
• Material: High-temperature resistant stainless steel
• Mounting Type: Quick-change modular nozzle design
• Purpose of Use: Removal and rework of large BGA components
• Field of Use: PCB repair, electronic production, service, prototyping, and rework applications
