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• Metcal QX2 Rework System
• Product Type: Box Reflow Nozzle (Box-type Hot Air Nozzle)
• Model: NZ-B33
• Nozzle Size: 33 × 33 mm (Inner dimension)
• Nozzle Shape: Square (Box-type)
• Compatible Components: EMI/RF shielding cans, medium-sized BGA, QFP, and square SMD components
• Heating Technology: Precise convection hot air
• Air Flow: Box nozzle design providing environmental and homogeneous hot air distribution
• Material: High-temperature resistant stainless steel
• Mounting Type: Quick-change modular nozzle for QX2 system
• Purpose of Use: Removal and rework of square SMD components, EMI shields, and metal enclosures
• Field of Use: PCB repair, electronic production, SMD service, prototyping, and rework applications
